- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/42 - Plated through-holes
Patent holdings for IPC class H05K 3/42
Total number of patents in this class: 1581
10-year publication summary
142
|
176
|
131
|
152
|
174
|
158
|
124
|
116
|
134
|
33
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ibiden Co., Ltd. | 1724 |
61 |
Intel Corporation | 45621 |
51 |
International Business Machines Corporation | 60644 |
43 |
Shinko Electric Industries Co., Ltd. | 1186 |
36 |
Avary Holding (Shenzhen) Co., Limited. | 275 |
35 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
32 |
Unimicron Technology Corp. | 449 |
32 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 124 |
28 |
Sumitomo Electric Industries, Ltd. | 14131 |
25 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
23 |
Sumitomo Electric Printed Circuits, Inc. | 267 |
23 |
Murata Manufacturing Co., Ltd. | 22355 |
21 |
Atotech Deutschland GmbH | 586 |
21 |
Sanmina Corporation | 193 |
21 |
Samsung Electronics Co., Ltd. | 131630 |
17 |
Kyocera Corporation | 12735 |
17 |
Catlam LLC | 27 |
17 |
MacDermid Enthone Inc. | 237 |
16 |
Rohm and Haas Electronic Materials LLC | 637 |
16 |
LG Innotek Co., Ltd. | 6758 |
15 |
Other owners | 1031 |